Ukulawulwa kwezimboni i-PCB FR4 ehlanganisa igolide nezingqimba ezingama-26
Ukucaciswa komkhiqizo:
I-Base Material: | I-FR4 TG170 |
Ubukhulu be-PCB: | 6.0+/-10%mm |
Ukubalwa Kwesendlalelo: | 26L |
Ukuqina Kwethusi: | 2 oz kuzo zonke izendlalelo |
Ukwelashwa kwendawo: | Ukucwenga igolide 60U” |
Imaski ye-solder: | Okuluhlaza okucwebezelayo |
Isikrini sikasilika: | Emhlophe |
Inqubo ekhethekile : | I-countersink, i-plating yegolide, ibhodi elisindayo |
Isicelo
I-PCB yokulawula izimboni iyibhodi lesifunda eliphrintiwe elisetshenziswa ezinhlelweni zokulawula izimboni ukuqapha nokulawula imingcele ehlukahlukene njengezinga lokushisa, umswakama, ingcindezi, isivinini, nokunye okuguquguqukayo kwenqubo.Lawa ma-PCB ngokuvamile aqinile futhi aklanyelwe ukumelana nezimo zezimboni ezinokhahlo njengalezo ezitholakala ezimbonini zokukhiqiza, izitshalo zamakhemikhali, nemishini yezimboni.Ama-PCB okulawula izimboni ngokuvamile ahlanganisa izingxenye ezifana nama-microprocessors, izilawuli ze-programmable logic (PLCs), izinzwa, nama-actuator asiza ukulawula nokuthuthukisa izinqubo ezihlukahlukene.Angase futhi afake izixhumanisi zokuxhumana ezifana ne-Ethernet, i-CAN, noma i-RS-232 yokushintshisana kwedatha nezinye izisetshenziswa.Ukuqinisekisa ukwethembeka okuphezulu nokusebenza okuqhubekayo, ama-PCB okulawula izimboni abhekana nokuhlolwa okuqinile kanye nezinyathelo zokulawula ikhwalithi ngesikhathi sokuklama kwawo kanye nenqubo yokukhiqiza.Kufanele futhi bahambisane namazinga embonini afana ne-UL, CE, ne-RoHS, phakathi kokunye.
I-PCB yezendlalelo eziphakeme iyibhodi lesifunda eliphrintiwe elinezingqimba eziningi zemikhondo yethusi nezinto zikagesi ezishumekwe phakathi kwazo.Ngokuvamile zinezingqimba ezingaphezu kwezingu-6 futhi zingakhuphukela ku-50 noma ngaphezulu, kuye ngobunkimbinkimbi bomklamo wesifunda.Ama-PCB ezendlalelo eziphakeme awusizo lapho uklama amadivayisi ahlangene adinga inani elikhulu lezingxenye.Basiza ukuthuthukisa ukwakheka kwebhodi lesekethe ngokuhambisa amathrekhi ayinkimbinkimbi nokuxhumeka ngezandlalelo eziningi.Lokhu kubangela umklamo ohlangene futhi osebenza kahle ogcina isikhala ebhodini.Lawa mabhodi ngokuvamile asetshenziswa ezinhlelweni zikagesi ezisezingeni eliphezulu, njengezimboni ze-aerospace, ezokuvikela, nezokuxhumana.Adinga amasu okukhiqiza athuthukile, njengokumba nge-laser kanye nokulawulwa kokungena kwe-impedance, ukuze kuqinisekiswe ukunemba okuphezulu nokuthembeka.Ngenxa yobunkimbinkimbi bawo, ukuklama nokukhiqiza ama-PCB ezendlalelo eziphezulu angabiza kakhulu futhi adle isikhathi kunama-PCB ajwayelekile.Ukwengeza, uma i-PCB inezendlalelo eziningi, ayanda amathuba okuba namaphutha ngesikhathi sokuklama nokukhiqiza.Ngenxa yalokho, ama-PCB ezendlalelo eziphakeme adinga ukuhlolwa okubanzi nezinyathelo zokulawula ikhwalithi ukuze kuqinisekiswe ukusebenza kwawo nokwethembeka.
I-Countersink i-PCB isho inqubo yokubhoboza imbobo ebhodini bese usebenzisa ibhithi elikhulu lobubanzi ukuze udale ikhefu eliyindilinga elizungeze imbobo.Lokhu kuvame ukwenziwa lapho inhloko yesikulufu noma ibhawudi idinga ukushaywa ngobuso be-PCB.I-Countersink ivamise ukwenziwa phakathi nesigaba sokumba sokukhiqiza i-PCB, ngemuva kokuthi izendlalelo zethusi ziqoshwe nangaphambi kokuba ibhodi lidlule kumaski we-solder kanye nenqubo yokuphrinta yesikrini sikasilika.Usayizi nokuma kwembobo ephikisayo izoncika ekusetshenzisweni kwesikulufu noma ibhawudi kanye nogqinsi nezinto ze-PCB.Kubalulekile ukuqinisekisa ukuthi ukujula kukasinki nobubanzi kufanelekile ukugwema ukulimaza izingxenye noma ukulandelelwa kwe-PCB.I-Countersink i-PCB ingaba yindlela ewusizo lapho uklama imikhiqizo edinga indawo ehlanzekile neyisicaba.Ivumela izikulufu namabhawudi ukuthi zihlale kahle ebhodini, zidale ukubukeka okujabulisa kakhudlwana futhi zivimbele ukusnakwa noma ukulimala kwezibophelelo ezivele ngaphandle.
Imibuzo Evame Ukubuzwa
Ukucwenga igolide wuhlobo lwe-PCB surface finish, eyaziwa nangokuthi i-nickel gold electroplating.Enqubweni yokukhiqiza ye-PCB, ukucwenga igolide ukubeka ungqimba lwegolide olubekwe phezu kwejazi elingumgoqo le-nickel nge-electroplating.Ukucwenga igolide kungahlukaniswa ngokuthi ''i-hard gold plating'' kanye ''ne-soft gold plating''.
Okuvame ukusetshenziswa ngokuhambisana ne-nickel plating, ungqimba oluncane lwegolide luvikela ingxenye ekugqwaleni, ekushiseni, ekugugekeni futhi isiza ukuqinisekisa ukuxhumana okuthembekile kukagesi.
I-hard gold plating i-electrodeposit yegolide ehlanganiswe nenye i-elementi ukuze kuguqulwe ukwakheka kwezinhlamvu zegolide.I-Soft Gold Plating iyi-electrodeposit yegolide yokuhlanzeka ephezulu kakhulu;empeleni iyigolide elihlanzekile ngaphandle kokwengezwa kwanoma yiziphi izakhi ze-alloying
Imbobo kasinki iyimbobo emise okwekhoni efakwe inothi noma ebhobozwe ku-PCB laminate.Le mbobo ecijile ivumela isikulufu sesokhethi esinekhanda eliyisicaba ukuthi sifakwe embobeni ebhoboziwe.Ama-countersink aklanyelwe ukuvumela ibhawodi noma isikulufu ukuthi sihlale sishutheke ngaphakathi ngendawo yebhodi ehleliwe.
82degrees, 90degrees kanye 100degrees