Industrial PCB electronics PCB high TG170 12 izendlalelo ENIG

I-High Layer PCB (I-PCB Yesendlalelo Esiphezulu) iyi-PCB (Ibhodi Lesifunda Eliphrintiwe, ibhodi lesifunda eliphrintiwe) elinezendlalelo ezingaphezu kweziyisi-8.Ngenxa yezinzuzo zayo zebhodi lesifunda elinezingqimba eziningi, ukuminyana kwesekethe ephakeme kungafinyelelwa endaweni encane, okwenza kube nomklamo oyinkimbinkimbi wesekethe, ngakho-ke ifaneleka kakhulu ukucubungula isignali yedijithali enesivinini esikhulu, ifrikhwensi yomsakazo we-microwave, imodemu, isiphetho esiphezulu. iseva , ukugcinwa kwedatha nezinye izinkambu.Amabhodi esekethe esezingeni eliphezulu ngokuvamile enziwa ngamabhodi aphezulu e-TG FR4 noma ezinye izinto ze-substrate ezisebenza kahle, ezingagcina ukuzinza kwesifunda endaweni yokushisa ephezulu, enomswakama ophezulu, kanye ne-high-frequency.

Mayelana namanani e-TG ezinto ze-FR4

I-FR-4 substrate iyisistimu ye-epoxy resin, ngakho-ke isikhathi eside, inani le-Tg liyinkomba evame kakhulu esetshenziselwa ukuhlukanisa i-FR-4 substrate grade, futhi ingenye yezinkomba zokusebenza ezibaluleke kakhulu ekucacisweni kwe-IPC-4101, i-Tg. inani lesistimu ye-resin, ibhekisela kwinto esuka esimweni esiqinile noma "esingilazini" ukuya endaweni ekhubazekile kalula noma ethambile yesimo sokushintsha izinga lokushisa.Lolu shintsho lwe-thermodynamic luhlala luhlehliswa inqobo nje uma i-resin ingaboli.Lokhu kusho ukuthi uma okokusebenza kushisiswa kusuka kuzinga lokushisa legumbi kuya ezingeni lokushisa elingaphezu kwevelu ye-Tg, bese kupholiswa ngaphansi kwevelu ye-Tg, ingabuyela esimweni sayo sangaphambilini esiqinile nezici ezifanayo.

Kodwa-ke, uma okokusebenza kushisiswe kuzinga lokushisa eliphakeme kakhulu kunenani layo le-Tg, izinguquko zesimo sesigaba esingenakuhlehliswa zingase zibangwe.Umphumela walokhu kushisa uhlobene kakhulu nohlobo lwezinto ezibonakalayo, kanye nokubola okushisayo kwe-resin.Ngokuvamile, ukuphakama kwe-Tg ye-substrate, kuyanda ukuthembeka kwento.Uma inqubo ye-welding engenawo umthofu yamukelwa, izinga lokushisa lokubola kwe-thermal (Td) le-substrate kufanele licatshangelwe.Ezinye izinkomba zokusebenza ezibalulekile zifaka i-thermal expansion coefficient (CTE), ukumuncwa kwamanzi, izakhiwo zokunamathisela zezinto, kanye nokuhlolwa kwesikhathi sokwendlalela okuvame ukusetshenziswa okufana nokuhlolwa kwe-T260 ne-T288.

Umehluko osobala kakhulu phakathi kwezinto ze-FR-4 inani le-Tg.Ngokwezinga lokushisa le-Tg, i-FR-4 PCB imvamisa ihlukaniswa ngamapuleti e-Tg aphansi, e-Tg amaphakathi kanye namapuleti e-Tg aphezulu.Embonini, i-FR-4 ene-Tg ezungeze u-135℃ ivamise ukuhlukaniswa njenge-Tg PCB ephansi;I-FR-4 cishe ku-150℃ yaguqulwa yaba i-Tg PCB emaphakathi.I-FR-4 ene-Tg cishe engu-170 ℃ yahlukaniswa njenge-Tg PCB ephezulu.Uma kunezikhathi eziningi zokucindezela, noma izendlalelo ze-PCB (izingqimba ezingaphezu kwezingu-14), noma izinga lokushisa eliphezulu lokushisela (≥230℃), noma izinga lokushisa eliphezulu lokusebenza (ngaphezu kuka-100℃), noma ukucindezeleka okushisayo okushisela okuphezulu (okufana ne-wave soldering), high Tg PCB kufanele kukhethwe.