Multi circuit amabhodi maphakathi TG150 8 izingqimba

Ake sethule ulwazi oluthile lwe-pcb yethusi ukujiya.

Icwecwe le-Copper njengomzimba oqhutshwayo we-pcb, ukunamathela kalula kungqimba lokufakwa ngaphakathi, iphethini yokugqwala yesekethe.Ugqinsi lwecwecwe lethusi zivezwa ngo-oz(oz), 1oz=1.4mil, futhi ukushuba okumaphakathi kwefoyili yethusi kuvezwa ngesisindo ngeyunithi ngayinye. indawo ngefomula: 1oz=28.35g/ FT2(FT2 yizinyawo eziyisikwele, unyawo-skwele olu-1 =0.09290304㎡).
International pcb zethusi ucwecwe evame ukusetshenziswa ukujiya: 17.5um, 35um, 50um, 70um. Ngokuvamile, amakhasimende awenzi amazwi akhethekile lapho enza i-pcb. Ugqinsi lwethusi lwezinhlangothi ezingashadile nezikabili ngokuvamile luyi-35um, okungukuthi, ithusi elingu-1 amp. Vele, amanye amabhodi aqondile azosebenzisa i-3OZ, 4OZ, 5OZ... 8OZ, njll., ngokuya ngezidingo zomkhiqizo ukukhetha ukujiya okufanele kwethusi.

Ugqinsi lwethusi olujwayelekile lwebhodi le-PCB eliseceleni elilodwa neliphindwe kabili licishe libe ngu-35um, kanti olunye ugqinsi lwethusi luyi-50um no-70um. Ugqinsi lwethusi olungaphezulu lwepuleti le-multilayer ngokuvamile luyi-35um, kanti ugqinsi lwethusi lwangaphakathi luyi-17.5um. Ukusetshenziswa Pcb ibhodi zethusi ukujiya ikakhulukazi incike ukusetshenziswa PCB kanye signal voltage, usayizi wamanje, 70% we ibhodi wesifunda isebenzisa 3535um ucwecwe yethusi ukujiya. Vele, ibhodi lesifunda lamanje likhulu kakhulu, ukujiya kwethusi kuzosetshenziswa 70um, 105um, 140um (okumbalwa kakhulu)
Ukusetshenziswa kwebhodi le-Pcb kuhlukile, ukusetshenziswa kokuqina kwethusi nakho kuhlukile. Njengemikhiqizo evamile yabathengi nezokuxhumana, sebenzisa i-0.5oz, 1oz, 2oz; Esikhathini esiningi samanje esikhulu, njengemikhiqizo yamandla kagesi aphezulu, ibhodi yokuphakela amandla neminye imikhiqizo, ngokuvamile kusetshenziswa ama-3oz noma ngaphezulu imikhiqizo yethusi ewugqinsi.

Inqubo ye-lamination yamabhodi wesifunda ngokuvamile imi kanje:

1. Ukulungiselela: Lungiselela umshini wokulahla kanye nezinto ezidingekayo (okuhlanganisa amabhodi wesifunda kanye nama-foil ethusi okuzokwenziwa i-laminated, amapuleti okucindezela, njll.).

2. Ukwelashwa kokuhlanza: Hlanza futhi ukhiphe i-deoxidize ingaphezulu lebhodi lesifunda kanye ne-copper foil ezocindezelwa ukuze kuqinisekiswe ukusebenza kahle kwe-soldering nokusebenza kokubopha.

3. Lamination: Laminate foil yethusi kanye nebhodi lesifunda ngokuvumelana nezidingo, ngokuvamile ungqimba olulodwa lwebhodi lesifunda kanye nongqimba olulodwa lwe-foil yethusi lupakishwa ngokushintshana, futhi ekugcineni kutholakala ibhodi lesifunda elinezingqimba eziningi.

4. Ukuma nokucindezela: faka ibhodi lesifunda elaminethiwe emshinini wokucindezela, bese ucindezela ibhodi lesifunda elinezingqimba eziningi ngokubeka ipuleti lokucindezela.

5. Inqubo yokucindezela: Ngaphansi kwesikhathi esinqunyiwe nokucindezela, ibhodi lesifunda kanye ne-foil yethusi kucindezela ndawonye ngomshini wokucindezela ukuze kuhlanganiswe ngokuqinile ndawonye.

6. Ukwelashwa kokupholisa: Beka ibhodi lesifunda elicindezelwe endaweni yokupholisa ukuze uthole ukwelashwa okupholisa, ukuze lifinyelele izinga lokushisa elizinzile kanye nesimo sokucindezela.

I-7.Ukucutshungulwa okulandelayo: Engeza izilondolozi ebusweni bebhodi lesifunda, wenze ukucubungula okulandelayo njengokumba, ukufaka iphini, njll., ukuqedela yonke inqubo yokukhiqiza yebhodi lesifunda.