Ngokwezifiso 4-ungqimba Black Soldermask PCB nge-BGA
Ukucaciswa komkhiqizo:
| Izinto eziyisisekelo: | I-FR4 TG170+PI |
| Ubukhulu be-PCB: | Okuqinile: 1.8+/-10%mm, flex: 0.2+/-0.03mm |
| Ukubalwa Kwesendlalelo: | 4L |
| Ukuqina Kwethusi: | 35um/25um/25um/35um |
| Ukwelashwa kwendawo: | ENIG 2U” |
| Imaski yeSolder: | Okuluhlaza okucwebezelayo |
| Isikrini sikasilika: | Emhlophe |
| Inqubo Ekhethekile: | I-Rigid+flex |
Isicelo
Njengamanje, ubuchwepheshe be-BGA busetshenziswe kabanzi emkhakheni wekhompyutha (ikhompyutha ephathekayo, i-supercomputer, ikhompyutha yezempi, ikhompyutha yezokuxhumana), inkambu yezokuxhumana (ama-pager, amafoni aphathwayo, amamodemu), inkambu yezimoto (abalawuli abahlukahlukene bezinjini zezimoto, imikhiqizo yokuzijabulisa yezimoto) . Isetshenziswa ezinhlobonhlobo zemishini yokwenziwa, evame kakhulu okuyizinhlaka, amanethiwekhi nezixhumi. Izicelo zayo eziqondile zifaka i-walkie-talkie, isidlali, ikhamera yedijithali ne-PDA, njll.
Imibuzo Evame Ukubuzwa
Ama-BGA (Ama-Ball Grid Arrays) ayizingxenye ze-SMD ezinoxhumo ngaphansi kwengxenye. Iphinikhodi ngayinye ihlinzekwa ngebhola le-solder. Konke ukuxhumeka kusakazwa kugridi yendawo efanayo noma i-matrix engxenyeni.
Amabhodi e-BGA anokuxhumana okuningi kunama-PCB avamile, okuvumela ukuminyana okuphezulu, ama-PCB anosayizi omncane. Njengoba izikhonkwane zingaphansi kwebhodi, izinkomba nazo zifushane, zinikeza ukuqhutshwa okungcono nokusebenza ngokushesha kwedivayisi.
Izingxenye ze-BGA zinendawo lapho zizoziqondanisa khona njengoba i-solder iqina futhi iqina esiza ngokubeka okungaphelele.. Ingxenye ibe isishisisiwe ukuxhuma imikhondo ku-PCB. Intaba ingasetshenziselwa ukugcina isikhundla sengxenye uma i-soldering yenziwa ngesandla.
BGA amaphakheji okunikezwayoukuminyana kwephini eliphezulu, ukumelana nokushisa okuphansi, kanye ne-inductance ephansikunezinye izinhlobo zamaphakheji. Lokhu kusho izikhonkwane zokuxhuma ezengeziwe kanye nokusebenza okukhulisiwe ngesivinini esiphezulu uma kuqhathaniswa namaphakheji amabili emugqeni noma ayisicaba. I-BGA ayikho ngaphandle kobubi bayo, noma kunjalo.
Ama-BGA ICsokunzima ukuwahlola ngenxa yezikhonkwane ezifihlwe ngaphansi kwephakheji noma umzimba we-IC. Ngakho-ke ukuhlolwa okubukwayo akunakwenzeka futhi ukukhishwa kwe-soldering kunzima. Ijoyinti ye-BGA IC solder ne-PCB pad ijwayele ukucindezeleka okuguquguqukayo nokukhathala okubangelwa iphethini yokushisa enqubweni ye-reflow soldering.
Ikusasa le-BGA Package ye-PCB
Ngenxa yezizathu zokuphumelela kwezindleko kanye nokuqina, amaphakheji e-BGA azothandwa kakhulu ezimakethe zemikhiqizo kagesi neye-elekthronikhi esikhathini esizayo. Ngaphezu kwalokho, kunezinhlobo eziningi zephakheji ze-BGA ezakhiwe ukuze zihlangabezane nezidingo ezahlukene embonini ye-PCB, futhi kunezinzuzo eziningi ezinhle ngokusebenzisa lobu buchwepheshe, ngakho-ke singalindela ngempela ikusasa eliqhakazile ngokusebenzisa iphakheji ye-BGA, uma unayo imfuneko, sicela ukhululeke ukuxhumana nathi.
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