Ngokwezifiso 4-ungqimba Black Soldermask PCB nge-BGA
Ukucaciswa komkhiqizo:
I-Base Material: | I-FR4 TG170+PI |
Ubukhulu be-PCB: | Okuqinile: 1.8+/-10%mm, flex: 0.2+/-0.03mm |
Ukubalwa Kwesendlalelo: | 4L |
Ukuqina Kwethusi: | 35um/25um/25um/35um |
Ukwelashwa kwendawo: | ENIG 2U” |
Imaski yeSolder: | Okuluhlaza okucwebezelayo |
Isikrini sikasilika: | Emhlophe |
Inqubo Ekhethekile: | I-Rigid+flex |
Isicelo
Njengamanje, ubuchwepheshe be-BGA busetshenziswe kabanzi emkhakheni wekhompyutha (ikhompyutha ephathekayo, i-supercomputer, ikhompyutha yezempi, ikhompyutha yezokuxhumana), inkambu yezokuxhumana (ama-pager, amafoni aphathwayo, amamodemu), inkambu yezimoto (abalawuli abahlukahlukene bezinjini zezimoto, imikhiqizo yokuzijabulisa yezimoto) .Isetshenziswa ezinhlobonhlobo zemishini yokwenziwa, evame kakhulu okuyizinhlaka, amanethiwekhi nezixhumi.Izicelo zayo eziqondile zifaka i-walkie-talkie, isidlali, ikhamera yedijithali ne-PDA, njll.
Imibuzo Evame Ukubuzwa
Ama-BGA (Ama-Ball Grid Arrays) ayizingxenye ze-SMD ezinoxhumo ngaphansi kwengxenye.Iphinikhodi ngayinye ihlinzekwa ngebhola le-solder.Konke ukuxhumeka kusakazwa kugridi yendawo efanayo noma i-matrix engxenyeni.
Amabhodi e-BGA anokuxhumana okuningi kunama-PCB avamile, okuvumela ukuminyana okuphezulu, ama-PCB anosayizi omncane.Njengoba izikhonkwane zingaphansi kwebhodi, izinkomba nazo zifushane, zinikeza ukuqhutshwa okungcono nokusebenza ngokushesha kwedivayisi.
Izingxenye ze-BGA zinendawo lapho zizoziqondanisa khona njengoba i-solder iqina futhi iqina esiza ngokubeka okungaphelele..Ingxenye ibe isishisisiwe ukuxhuma imikhondo ku-PCB.Intaba ingasetshenziselwa ukugcina isikhundla sengxenye uma i-soldering yenziwa ngesandla.
BGA amaphakheji okunikezwayoukuminyana kwephini eliphezulu, ukumelana nokushisa okuphansi, kanye ne-inductance ephansikunezinye izinhlobo zamaphakheji.Lokhu kusho izikhonkwane zokuxhuma ezengeziwe kanye nokusebenza okukhulisiwe ngesivinini esiphezulu uma kuqhathaniswa namaphakheji amabili emugqeni noma ayisicaba.I-BGA ayikho ngaphandle kobubi bayo, noma kunjalo.
Ama-BGA ICsokunzima ukuwahlola ngenxa yezikhonkwane ezifihlwe ngaphansi kwephakheji noma umzimba we-IC.Ngakho-ke ukuhlolwa okubukwayo akunakwenzeka futhi i-de-soldering inzima.Ijoyinti le-BGA IC solder ne-PCB pad lithambekele ekucindezelekeni okuguquguqukayo nokukhathala okubangelwa iphethini yokushisisa enqubweni yokuphinda kufakwe i-solder.
Ikusasa le-BGA Package ye-PCB
Ngenxa yezizathu zokuphumelela kwezindleko kanye nokuqina, amaphakheji e-BGA azothandwa kakhulu ezimakethe zemikhiqizo kagesi neye-elekthronikhi esikhathini esizayo.Ngaphezu kwalokho, kunezinhlobo eziningi zephakeji ze-BGA ezakhiwe ukuze zihlangabezane nezidingo ezahlukene embonini ye-PCB, futhi kunezinzuzo eziningi ezinhle ngokusebenzisa lobu buchwepheshe, ngakho-ke singalindela ngempela ikusasa eliqhakazile ngokusebenzisa iphakheji ye-BGA, uma unayo imfuneko, sicela ukhululeke ukuxhumana nathi.