I-Prototype ephrintiwe wesekethe amabhodi RED solder imaski izimbobo castellated

Izinqubo zama-plated half holes yilezi:
1. Cula imbobo eseceleni ngethuluzi lokusika elimise okuka-V kabili.

2. Umshini wokubhoboza wesibili wengeza izimbobo eziqondisayo ohlangothini lwembobo, ususa isikhumba sethusi kusenesikhathi, unciphisa ama-burrs, futhi usebenzisa ama-groove cutters esikhundleni sokubhoboza ukuze ukhulise isivinini nokwehla.

3. Gxilisa ithusi ku-electroplate i-substrate, ukuze ungqimba lwethusi lufakwe i-electroplated odongeni lwembobo yembobo eyindilinga emaphethelweni ebhodi.

4. Ukukhiqizwa kwesekethe yongqimba yangaphandle ngemva kokulahlwa, ukuchayeka, nokuthuthukiswa kwe-substrate ngokulandelana, i-substrate ingaphansi kwe-copper plating yesibili kanye ne-tin plating, ukuze ungqimba lwethusi odongeni lwembobo yembobo eyindilinga onqenqemeni lwebhodi luqiniswe futhi ungqimba lwethusi lumbozwe ungqimba lwethini lokumelana nokugqwala;

5. Ukwakhiwa kwehhafu yembobo ukusika imbobo eyindilinga onqenqemeni lwebhodi ibe uhhafu ukuze wenze uhhafu wembobo;

6. Esinyathelweni sokususa ifilimu, ifilimu ye-anti-electroplating ecindezelwe phakathi nenqubo yokucindezela ifilimu isusiwe;

7. Ukufaka i-substrate kuqoshwe, futhi ithusi eliveziwe engxenyeni yangaphandle ye-substrate isuswa ngokufaka;

8. I-tin ehlubula i-substrate ikhishwa ithini, ukuze ithini esodongeni lwembobo yesigamu ingasuswa, futhi ungqimba lwethusi odongeni lwembobo yesigamu luvezwe.

9. Ngemva kokwenza, sebenzisa itheyiphu ebomvu ukuze unamathisele amabhodi amayunithi ndawonye, ​​bese ususa ama-burrs ngomugqa wokufaka i-alkaline.

10. Ngemuva kokufakwa kwethusi kwesibili nokufakwa kwe-tin ku-substrate, imbobo eyindilinga emaphethelweni ebhodi inqunywa ngesigamu ukuze yenze umgodi wesigamu, ngoba ungqimba lwethusi odongeni lwembobo lumbozwe ungqimba lwe-tin, futhi ungqimba lwethusi lodonga lwembobo luhlangene ngokuphelele nongqimba lwethusi lwengqimba yangaphandle ye-substrate esebenzayo ingavimbela ukuxhuma okuqinile kwe-substrate. udonga lwembobo ekukhishweni noma i-copper warping lapho usikwa;

11. Ngemva kokuqedwa kokwakhiwa kwe-half-hole, ifilimu iyasuswa bese igxilwa, ukuze indawo yethusi ingabi ne-oxidized, igweme ngokuphumelelayo ukuvela kwethusi elisele noma ngisho nesifunda esifushane, futhi sithuthukise izinga lokukhiqiza lebhodi lesifunda le-PCB le-metallized half-hole.