I-Prototype ephrintiwe wesekethe amabhodi RED solder imaski izimbobo castellated

Izinqubo zama-plated half holes yilezi:
1. Cula imbobo eseceleni ngethuluzi lokusika elimise okuka-V kabili.

2. Umshini wokubhoboza wesibili wengeza izimbobo eziqondisayo ohlangothini lwembobo, ususa isikhumba sethusi kusenesikhathi, unciphisa ama-burrs, futhi usebenzisa ama-groove cutters esikhundleni sokubhoboza ukuze ukhulise isivinini nokwehla.

3. Gxilisa ithusi ku-electroplate i-substrate, ukuze ungqimba lwethusi lufakwe i-electroplated odongeni lwembobo yembobo eyindilinga emaphethelweni ebhodi.

4. Ukukhiqizwa kwesekethe yongqimba yangaphandle ngemva kokucwenga, ukuchayeka, nokuthuthukiswa kwe-substrate ngokulandelana, i-substrate ingaphansi kwe-copper plating yesibili kanye ne-tin Plating, ukuze ungqimba lwethusi odongeni lwembobo yembobo eyindilinga emaphethelweni ibhodi liqina futhi ungqimba lwethusi lumbozwe ungqimba lwethini lokumelana nokugqwala;

5. Ukwakhiwa kwehhafu yembobo ukusika imbobo eyindilinga onqenqemeni lwebhodi ibe uhhafu ukuze wenze uhhafu wembobo;

6. Esinyathelweni sokususa ifilimu, ifilimu ye-anti-electroplating ecindezelwe phakathi nenqubo yokucindezela ifilimu isusiwe;

7. Ukufaka i-substrate kuqoshwe, futhi ithusi eliveziwe engxenyeni yangaphandle ye-substrate isuswa ngokufaka;

8. I-tin ehlubula i-substrate ikhishwa ithini, ukuze ithini esodongeni lwembobo yesigamu ingasuswa, futhi ungqimba lwethusi odongeni lwembobo yesigamu luvezwe.

9. Ngemva kokwenza, sebenzisa itheyiphu ebomvu ukuze unamathisele amabhodi amayunithi ndawonye, ​​bese ususa ama-burrs ngomugqa wokufaka i-alkaline.

10. Ngemuva kokucwetshwa kwethusi kwesibili nokufakwa kwe-tin phezu kwe-substrate, imbobo eyindilinga emaphethelweni ebhodi iyasikwa ibe yisigamu ukuze ibe uhafu wembobo, ngoba ungqimba lwethusi lodonga lwembobo lumbozwe ungqimba lwethini, futhi ungqimba lwethusi lodonga lwembobo luqinile ngokuphelele nongqimba lwethusi lwengqimba yangaphandle ye-substrate Connection, ehilela amandla okubopha okuqinile, angavimbela ngokuphumelelayo ungqimba lwethusi odongeni lwembobo ukuthi lukhishwe noma i-warping yethusi lapho usika;

11. Ngemva kokuqedwa kokwakhiwa kwembobo ewuhhafu, ifilimu iyasuswa bese igxilwa, ukuze indawo yethusi ingabi ne-oxidized, igweme ngokuphumelelayo ukuvela kwethusi elisele noma ngisho nesifunda esifushane, futhi sithuthukise izinga lokukhiqiza lengxenye yensimbi. -imbobo PCB wesifunda ibhodi.