Siyakwamukela kuwebhusayithi yethu.

Quick Turn pcb surface treatment HASL LF RoHS

Incazelo emfushane:

Izinto eziyisisekelo: FR4 TG140

Ubukhulu be-PCB: 1.6+/-10% mm

Isibalo sesendlalelo: 2L

Ukuqina Kwethusi: 1/1 oz

Ukwelashwa kwendawo: HASL-LF

Imaski ye-Solder: Emhlophe

Isikrini sikasilika: Esimnyama

Inqubo ekhethekile : Okujwayelekile


Imininingwane Yomkhiqizo

Omaka bomkhiqizo

Ukucaciswa komkhiqizo:

I-Base Material: I-FR4 TG140
Ubukhulu be-PCB: 1.6+/-10%mm
Ukubalwa Kwesendlalelo: 2L
Ukuqina Kwethusi: 1/1 oz
Ukwelashwa kwendawo: I-HASL-LF
Imaski ye-solder: Emhlophe
Isikrini sikasilika: Emnyama
Inqubo ekhethekile : Okujwayelekile

Isicelo

Inqubo ye-HASL yebhodi lesifunda ngokuvamile ibhekisela kunqubo ye-pad HASL, okuwukuthi ukugqoka ithini endaweni ye-pad ebusweni bebhodi lesifunda.Ingadlala indima ye-anti-corrosion kanye ne-anti-oxidation, futhi ingaphinda ikhulise indawo yokuxhumana phakathi kwephedi nedivayisi edayisiwe, futhi ithuthukise ukuthembeka kwe-soldering.Ukugeleza kwenqubo ethile kuhlanganisa izinyathelo eziningi ezinjengokuhlanza, ukufakwa kwamakhemikhali kathayela, ukucwiliswa emanzini, nokuwasha.Khona-ke, ngenqubo efana ne-hot soldering, izosabela ukwakha isibopho phakathi kwe-tin kanye nedivaysi ye-splice.Ukufafaza ngamathini kumabhodi esekethe kuyinqubo esetshenziswa kakhulu futhi isetshenziswa kakhulu embonini yokukhiqiza ugesi.

I-HASL eholayo kanye ne-HASL engenamthofu ubuchwepheshe obubili bokwelapha obungaphezulu obusetshenziswa kakhulukazi ukuvikela izingxenye zensimbi zamabhodi esekethe ekutheni zingagqwali kanye ne-oxidation.Phakathi kwazo, ukwakheka kwe-HASL yomthofu yakhiwe ngamathini angama-63% kanye nokuhola okungu-37%, kuyilapho i-HASL engenamthofu yakhiwa ithini, ithusi nezinye izakhi (njengesiliva, i-nickel, i-antimony, njll.).Uma kuqhathaniswa ne-HASL esekelwe kumthofu, umehluko phakathi kwe-HASL engenawo umthofu ukuthi ihambisana kakhulu nemvelo, ngoba umthofu uyinto eyingozi ebeka imvelo nempilo yabantu engozini.Ngaphezu kwalokho, ngenxa yezakhi ezihlukene eziqukethwe ku-HASL engenamthofu, izakhiwo zayo ze-solder kanye nogesi zihluke kancane, futhi zidinga ukukhethwa ngokuvumelana nezidingo ezithile zohlelo lokusebenza.Ngokuvamile, izindleko ze-HASL engenamthofu ziphakeme kancane kune-HASL yomthofu, kodwa ukuvikelwa kwayo kwemvelo nokusebenza kwayo kungcono, futhi kuthandwa abasebenzisi abaningi ngokwengeziwe.

Ukuze uhambisane nomyalelo we-RoHS, imikhiqizo yebhodi lesifunda idinga ukuhlangabezana nalezi zimo ezilandelayo:

1. Okuqukethwe komthofu (Pb), i-mercury (Hg), i-cadmium (Cd), i-hexavalent chromium (Cr6+), i-polybrominated biphenyls (PBB) nama-diphenyl ethers enziwe nge-polybrominated (PBDE) kufanele kube ngaphansi kwenani lomkhawulo elishiwo.

2. Okuqukethwe kwezinsimbi eziyigugu njenge-bismuth, isiliva, igolide, i-palladium, neplatinamu kufanele kube ngaphakathi kwemikhawulo enengqondo.

3. Okuqukethwe kwe-halogen kufanele kube ngaphansi kwenani lomkhawulo elishiwo, okuhlanganisa i-chlorine (Cl), i-bromine (Br) ne-iodine (I).

4. Ibhodi lesifunda kanye nezingxenye zalo kufanele zibonise okuqukethwe kanye nokusetshenziswa kwezinto ezinobuthi ezifanele neziyingozi.Lokhu okungenhla kungenye yezimo eziyinhloko zokuthi amabhodi esekethe ahambisane nomyalelo we-RoHS, kodwa izidingo ezithile zidinga ukunqunywa ngokuvumelana nemithetho yendawo kanye namazinga.

Imibuzo Evame Ukubuzwa

1.Iyini i-HASL/HASL-LF?

I-HASL noma i-HAL (yokulinganisa komoya oshisayo (i-solder)) iwuhlobo lokuqeda olusetshenziswa kumabhodi esekethe aphrintiwe (ama-PCB).I-PCB ivamise ukucwiliswa kubhavu we-solder encibilikisiwe ukuze zonke izindawo zethusi eziveziwe zimbozwe nge-solder.I-solder eyeqile isuswa ngokudlula i-PCB phakathi kwemibese yomoya oshisayo.

2.Kuyini ukujiya okujwayelekile kwe-HASL/HASL-LF?

I-HASL (Ejwayelekile): Ngokuvamile i-Tin-Lead – HASL (Ihola Ngokukhululekile): Ivamise ukuba i-Tin-Copper, Tin-Copper-Nickel, noma i-Tin-Copper-Nickel Germanium.Ugqinsi olujwayelekile: 1UM-5UM

3.Ingabe i-HASL-LF RoHS iyahambisana?

Ayisebenzisi i-Tin-Lead solder.Kunalokho, i-Tin-Copper, Tin-Nickel noma i-Tin-Copper-Nickel Germanium ingasetshenziswa.Lokhu kwenza i-LEad-Free HASL ibe ukukhetha ukonga nokuthobela i-RoHS.

4.Yini umehluko phakathi kwe-HASL ne-LF- HASL

I-Hot Air Surface Leveling(HASL) isebenzisa umthofu njengengxenye ye-solder alloy yayo, ethathwa njengeyingozi kubantu.Kodwa-ke, i-Lead-free Hot Air Surface Leveling (LF-HASL) ayisebenzisi umthofu njengengxube ye-solder, okwenza iphephe kubantu kanye nemvelo.

5.Iziphi izinzuzo ze-HASL/HASL-LF.

I-HASL iyonga futhi itholakala kabanzi

Ine-solderability enhle kakhulu nempilo enhle yeshelufu.


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